multilayer ceramic chip capacitors 1 of 3 creation date : december 14, 2017 (gmt) cgj5h4x7r2h332k115aa tdk item description cgj5h4x7r2h332kt**** applications high reliability grade feature mid mid voltage (100 to 630v) aec-q200 aec-q200 series cgj5(3216) [eia 1206] status production (not recommended for new design) size length(l) 3.20mm 0.20mm width(w) 1.60mm 0.20mm thickness(t) 1.15mm 0.15mm terminal width(b) 0.20mm min. terminal spacing(g) 1.00mm min. recommended land pattern (pa) 2.10mm to 2.50mm(flow soldering) 2.00mm to 2.40mm(re?ow soldering) recommended land pattern (pb) 1.10mm to 1.30mm(flow soldering) 1.00mm to 1.20mm(re?ow soldering) recommended land pattern (pc) 1.00mm to 1.30mm(flow soldering) 1.10mm to 1.60mm(re?ow soldering) electrical characteristics capacitance 3.3nf 10% rated voltage 500vdc temperature characteristic x7r(15%) dissipation factor (max.) 3% insulation resistance (min.) 10000m other soldering method wave (flow) re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : december 14, 2017 (gmt) cgj5h4x7r2h332k115aa characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance cgj5h4x7r2h332k115aa esr cgj5h4x7r2h332k115aa capacitance cgj5h4x7r2h332k115aa dc bias characteristic cgj5h4x7r2h332k115aa temperature characteristic cgj5h4x7r2h332k115aa(no bias) cgj5h4x7r2h332k115aa(dc bias = 250v ) ripple temperature rising cgj5h4x7r2h332k115aa(100khz) cgj5h4x7r2h332k115aa(500khz) cgj5h4x7r2h332k115aa(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : december 14, 2017 (gmt) cgj5h4x7r2h332k115aa associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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